The method of making a three-dimensional integrated circuit structure of integrated circuit structures and three-dimensional

The present invention discloses a method for manufacturing a three-dimensional and three-dimensional integrated circuit structure of integrated circuit structures. The method comprising: providing a substrate; forming a first dielectric layer on the chip substrate, forming a first recess in a first die chip dielectric layer, a first chip embedded in the first chip groove; a first dielectric chip a first through hole is formed on the dielectric layer dielectric layer, forming a first conductive via and the first conductive vias within the first trench dielectric layer; forming a second dielectric layer of the chip on the first dielectric layer through hole forming a second dielectric layer, a second chip groove chip, the second chip is embedded in the second chip groove; forming a second via dielectric layer on the second dielectric layer chip, the second through hole forming a dielectric layer of the second inner conductive vias, a third conductive vias in the second dielectric layer and the second chip vias dielectric layer, forming a second conductive vias in the second trench dielectric layer. This manufacturing method can reduce the manufacturing cost of a three-dimensional integrated circuit structure.