Plasma discharge of the seasoning layer for dechucking plasma immersion ion implantation process and wafer by chamber seasoning

In plasma immersion ion implantation process, a series of wafers without replacing the rather, the thickness of the pre-injection chamber seasoning layer is increased (the seasoning layer to loss of clamping electrostatic wafer due to the increased thickness of the seasoning layer injection to enable a). This is a residual electrostatic charge from the first thick seasoning layer is achieved by plasma discharge. The number of wafers that can be processed using the same seasoning layer, after each wafer is processed, is increased further by supplementing the seasoning layer partially, followed by a short period of time plasma discharge seasoning supplemented from, it is possible to process the next wafer.