Anisotropic conducting film and circuit board using same

The invention is named as an anisotropic conducting film and a circuit board using the same. The anisotropic conducting film exists among circuit electrodes arranged opposite, the circuit electrodes arranged opposite are pressurized, and electrodes in the pressurization direction are electrically connected. The anisotropic conducting film is characterized in that the conducting film is formed by overlapping a first bonding thin film layer containing a polymerized photopolymerization resin, a thermosetting resin, a curing agent for the thermosetting resin and conductive particles and a second bonding thin film layer containing the thermosetting resin and the curing agent for the thermosetting resin.