Printed circuit board and manufacturing method thereof

The invention discloses a printed circuit board and a manufacturing method of the printed circuit board. The printed circuit board comprises a substrate and is characterized in that at least one surface of the substrate is provided with two or more layers of conductive circuits which are overlaid vertically and arranged in a cross mode, an insulation material layer is arranged between every two vertically adjacent layers of conductive circuits, and the conductive circuits are isolated through the insulation material layers. According to the printed circuit board, conductive ink is adopted as conductive material for manufacturing the conductive circuits, and the multiple layers of conductive circuits arranged on the substrate in an overlaid mode are isolated through the insulation material layers, so that the layer number of the conductive circuits of the printed circuit board is increased, a laminated insulation hard board is not needed, the thickness of the printed circuit board is greatly reduced, and the printed circuit board is more adaptive to miniaturization electronic devices.