Method for monitoring crystal round pallet obliteration performance

The invention provides a method of monitoring the flatness of a wafer tray. A testing wafer is absorbed on the wafer tray; wherein, the method is used for monitoring whether the wafer tray is flat through monitoring whether the testing wafer is deformed. Compared with the prior art, the monitoring method provided by the invention can perform the real time monitoring to the wafer tray, and the method adopts a reference wafer to compare with the wafer absorbed on the wafer tray, the process of the method is simple, the special-purpose equipment and the software are not required, and the production cost can be effectively reduced.