An evaluation of BME C0G multilayer ceramic capacitors as building blocks for DC-Link capacitors in 3-D power electronics

Multilayer ceramic capacitors manufactured with different designs using a C0G Ni BME technology are evaluated as building blocks for DC-Link capacitors. Electrical and physical properties are compared to a commercially available DC-Link ceramic capacitor. Reliability evaluations at 600V and 200°C show that capacitors made with the C0G Ni BME have excellent reliability as well as high current handling capability that result in high power density. These properties coupled with high modulus of rupture, good board flexure resistance and thermal cycling capability make them excellent candidates for building blocks in 3D power electronics to meet higher temperature, voltage and switching frequency requirements. The benefits and limitations of transient liquid phase sintering materials and processes to replace solders for packaging are discussed.