An optimal approach with genetic algorithm for thermal performance of heat sink/TEC assembly

In the present study, a semi-empirical method that combines theoretical and experimental data for exploring the thermal performance of a heat sink with or without integrating TEC has been successfully established. By employing the genetic optimization technique, a series of constrained optimal designs have been performed. The independent variables for optimization search are the pumping capacity of the TEC (Q/sub c/), the electric current of the TEC (I) and the external thermal resistance between hot side of the TEC and ambient (R/sub ext/). The present objective for the optimization search is the maximum temperature difference between heat sinks with and without integrating TEC. The results show that optimal value of /spl Delta/T/sub b-c/ is 21.3/spl deg/C, with boundary limits of Q/sub c/ =10W, I=10A and R/sub ext/=0.25 /spl deg/C/W. However, this design results in a poor coefficient of performance (COP), say COP=0.17. Under a given constraint of COP/spl square/2, the optimal value of /spl Delta/T/sub b-c/ can be obtained to be 9.1 /spl deg/C with the corresponding Q/sub c/=14.8W, I=3.4A and R/sub ext/=0.25/spl deg/C/W. Comparisons between the results by the present optimal design and those obtained by the semi-empirical method have been made with a satisfactory agreement. The present optimal design shows that a heat sink/TEC assembly can provide an effective temperature reduction with high COP and extend the upper limits of air-cooled heat sinks.