Optimizing Board Level Reliability of a Novel LGA Package for IoT Applications

Abstract Technology development for Internet of Things applications is growing astronomically, increasing the demand for smaller, faster, and lower power solutions to run and power a vast array of connected machines and objects. The LS1012A is the smallest 64-bit processor on the market today, with a novel 211 LGA package that creates a mechanically robust and space efficient component. However, excellent board level reliability is required in order to meet the various IoT application needs. This study evaluates the board level reliability of the 211 LGA by performing single chamber thermomechanical cycling, monotonic bend testing, and JEDEC drop testing. The objective of this study is to fully optimize the board level performance of the 211 LGA without dramatically altering the package design. Two significant board level changes were applied to achieve significant board level performance, exceeding all projected application uses.