A method of forming an electronic device, the termination region having a having a isolatiionsgebiet

An electronic device may include an electronic device and a termination region adjacent to the electronic component area. In one embodiment, the termination region may have an isolation region which extends to a depth in a semiconductor layer, wherein the depth is less than 50% of the thickness of the semiconductor layer. In another embodiment, the termination region may include a first isolation region that extends to a first depth in the semiconductor layer, and a second isolation region that extends to a second depth in the semiconductor layer, wherein the second depth is less than the first depth. In another aspect, a method of forming an electronic device can include patterning a semiconductor layer to define a trench in the termination region, while another trench for an electronic component is formed in an electronic component area.