Shave-Off Profiling for TEM Specimens

This work aims to compare the results from the same specimens between shave-off profiling and TEM image. For the cross-check analysis, a specimen was picked up from a part was failed integrated chip (IC) package that may have suffered electro‐ chemical migration. Critical disagreement between the results was found in the gradient curve of the shave-off profiling from the anode to the cathode. In each package, shave-off profiling revealed a faint gradient curve on migrated ions that could not be revealed from TEM image.