Packaging structure capable of preventing offset of high-power LED (Light Emitting Diode) chip and preparation process of packaging structure

The invention discloses a packaging structure capable of preventing offset of a high-power LED (Light Emitting Diode) chip. A sealing groove is arranged in a packaging body; and in the sealing groove, one end of the LED chip is welded with the surface part of a positive electrode through a metal interconnecting layer to realize bonding connection, the sealing groove is mainly formed by an anti-offset groove arranged at the welding position of the LED chip, so that the LED chip is fixedly embedded into the anti-offset groove in a clearance fit manner, the anti-offset groove is used as a chip mounting groove and used for restraining the offset of the mounting position of the LED chip, and therefore, an LED reflow process is simplified, and the production efficiency and reliability are improved. The invention further discloses the preparation process of the packaging structure. According to the packaging structure and the preparation process, the anti-offset groove of which the size is slightly larger than that of the LED chip is made by an etching process or a precision machining technology, the reflow soldering or eutectic soldering is optimized, the production efficiency and reliability of an LED are improved, the alignment precision and aesthetics of packaging are improved, so that the light-emitting uniformity of the LED is remarkably improved.