Connecting technology for metals without solid solubility

The invention relates to a connecting technology for metals without solid solubility. The technology includes the steps that the first metal and the second metal to be connected are pretreated; powder of the second metal is pressed into a blank with the thickness of 2-5 mm; the first metal, the blank and the second metal are sequentially stacked; the first metal, the blank and the second metal which are sequentially stacked are fixed and pressed so that the first metal and the second metal can be tightly attached to the blank; and the first metal, the blank and the second metal which are fixed and pressed are subjected to annealing treatment, wherein the first metal is molybdenum or tungsten, the second metal is copper or silver, and the annealing temperature of the annealing treatment is 10-50 DEG C lower than the melting point of the second metal. According to the technical scheme, the technology is simple, and a uniform and continuous bonding interface and high bonding strength between the metals without solid solubility can be achieved.