High-frequency Characteristics of InGaP/GaAs Double Heterojunction Bipolar Transistor Epitaxially Grown on 200 mm Ge/Si Wafers

N-p-n InGaP/GaAs double heterojunction bipolar transistor has been successfully grown on a 200 mm Ge/Si wafer using metalorganic chemical vapor deposition with low defect density of 107 cm $^{-2}$ . Non-gold metals of Ni/Ge/Al and Ti/Al are used to form the ohmic contact for small pieces device fabrication. Both direct-current (dc) and high-frequency characteristics of the device were measured. The device with emitter area of $6\times8 \mu {\text {m}}^2$ shows a dc gain of 55 at a collector current of $I_{c}$ = 4 mA, with high collector-emitter breakdown voltage of ~17 V. The high-frequency response with cutoff frequency ( $f_{T}$ T) of 23 GHz and maximum available frequency ( $f_{\text {max}}$ T) of 10 GHz can be achieved. These results demonstrate that InGaP/GaAs double heterojunction bipolar transistor grown on low defect density Ge/Si wafer has the potential for realizing III-V CMOS integrated platform for high-frequency applications.