Transient liquid-phase bonding of superalloy K465 using a Ni–Cr–Fe–B–Si amorphous interlayer alloy
2015
A kind of Ni–Cr–Fe–B–Si system amorphous alloy was used as interlayer in transient liquid-phase bonding (TLP bonding) of polycrystalline superalloy K465. The bonding behavior, microstructure feature and the tensile properties of the joints were investigated. There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210 °C for 30 min. The isothermal solidification is complete after bonding at 1210 °C for 4 h. The relationship of the average width of the remnant eutectic zone and bonding time at 1210 °C is nonlinear. The tensile strength of the bonded joint at room temperature and 900 °C is comparable to that of K465 alloy.
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