the same sensor circuit module and electronic apparatus using

Sensor circuit module comprising a package substrate (2), a sensor element (4) which is mounted on the package substrate (2), and a semiconductor element (5) the type of an unpackaged chips, with through hole terminals (3, 22) in the end faces of the package substrate for inputting and outputting a signal, wherein the package substrate (2) is provided with a light transmission blocking means (18) for preventing light in a circuit formation region (5b) is transmitted of the semiconductor element (5) by an end surface of the package substrate (2), wherein the light transmission blocking means is a light-shielding coating material, are coated with the portions of the end faces of the package substrate (2) in which no through-hole terminals are formed.