Microprocessing machinability of organic material for semiconductor packaging by 248 nm excimer laser

We have developed several types of DUV excimer lasers. One of them is a high power 248 nm excimer laser with free spectrum operation. The 248 nm excimer laser can be applied to the process of organic materials for semiconductor packages. We are developing the processing of organic materials by 248 nm excimer laser. We confirmed that it is possible to form a via of 20 μm or less in an organic film. We will report the result of processing organic materials with 248 nm excimer laser.