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Reliability of flip-chip bonded RFID die using anisotropic conductive paste hybrid material
Reliability of flip-chip bonded RFID die using anisotropic conductive paste hybrid material
2011
Jun Sik
Lee
Jun Ki
Kim
Mok-Soon
Namhyun
Kang
Jong Hyun
Keywords:
conductive paste
Hybrid material
Flip chip
Die (integrated circuit)
Anisotropy
Materials science
Reliability (semiconductor)
Composite material
Correction
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