Composition for etching copper, and hydrogen peroxide-based composition for etching metal

The present invention relates to: a composition for etching copper; and a hydrogen peroxide-based composition for etching metal and, more specifically, to: a composition for etching copper, capable of inhibiting the generation of a copper precipitate from the etching composition by increasing the stability of a chelate bond formed between copper and organic matter; and a hydrogen peroxide-based composition for etching metal, capable of preventing the decomposition of hydrogen peroxide and the degeneration of the other components within the hydrogen peroxide-based composition for etching metal.