Thermal analysis of multi-layer functional 3D logic stacks

3D chip stacking technology has the potential to enable increased system performance through integration of heterogeneous system components, such as accelerators and high density memory, as well as through increased area for tightly integrated processor components in multi-core systems. This paper describes the design, measurements and a thermal modeling methodology used to achieve accurate 3D thermal model-to-hardware correlation for two and three layer 3D high-power “logic” stacks.