Wafer catching adaptive control method and device for chemically mechanical polishing transmission robot

The invention provides a wafer catching adaptive control method for a chemically mechanical polishing transmission robot. The wafer catching adaptive control method comprises the following steps that an infrared sensor detects a wafer position on a station and obtains a wafer position value on the station and stores the wafer position value; the stored wafer position on the station is corrected and compensated to obtain a first position value; the first position value and the last wafer position value on the station are summed to obtain an accurate value of the wafer position on the station, namely a second position value; the infrared sensor transmits the second position value serving as an input value to an input/output (I/O) plate; and the I/O plate sends the input value to a main controller to execute wafer catching and store the input value. According to the method, the adaptability of a manipulator of the chemically mechanical polishing transmission robot for catching wafers on stations is realized; and the wafer catching adaptive control method has high efficiency, precision and applicability. The invention also discloses a wafer catching adaptive control device for the chemically mechanical polishing transmission robot.