Solder material, solder joint, and production method for solder material

Provided is a solder material configured so that it is possible to minimize the growth of an oxide film. The solder material is a solder ball 1A configured from a solder layer 2 and a coating layer 3 that covers the solder layer 2. The solder layer 2 has a spherical shape and is configured from a metal material comprising an alloy in which the Sn content is 40% or more. The solder layer 2 is alternatively configured from a metal material in which the Sn content is 100%. The coating layer 3 comprises a SnO film 3a that is formed on the outside of the solder layer 2 and a SnO 2 film 3b that is formed on the outside of the SnO film 3a. The thickness of the coating layer 3 is greater than 0 nm and preferably equal to or less than 4.5 nm. In addition, the yellowness of the solder ball 1A is preferably 5.7 or less.