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Modeling of electromigration in through-silicon-via based 3D IC
Modeling of electromigration in through-silicon-via based 3D IC
2011
Jiwoo Pak
Mohit Pathak
Sung Kyu Lim
David Z. Pan
Keywords:
Through-silicon via
Electromigration
Three-dimensional integrated circuit
Integrated circuit
Electronic engineering
Materials science
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