Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives

The morphology and grain growth pattern of intermetallic compounds (IMCs) formed between the Cu substrate and Sn-3.5Ag solder doped with a small amount of additive (0.1 mass%), say, Ni or Co, was investigated. After soldering, a duplex structure due to the additive discontinuity at the (Cu, Ni)6Sn5 and (Cu, Co)6Sn5 region was detected. That is, the outer area of the (Cu, Ni)6Sn5 and (Cu, Co)6Sn5 region on the solder side contained much higher Ni or Co additive concentration than the inner area on the Cu side. The faceted-shape IMCs were observed at the outer area, while the rounded-shape were identified at the inner area of (Cu, Ni)6Sn5 and (Cu, Co)6Sn5. Based on the thermodynamic calculation, the higher solubility of additive at the outer area will enhance the enthalpy change during interfacial reaction and lead to the larger Jackson’s parameter; thus, the faceted IMC morphology was formed. Moreover, the abnormal grain growth (AGG) at the outer area of (Cu, Ni)6Sn5 and (Cu, Co)6Sn5 was demonstrated from the IMC grain size distribution, while the normal grain growth pattern was suggested for the inner area of the IMC region.