Drahtschneideelektroerodierbeabeitungsvorrichtung and semiconductor wafer manufacturing process

In Drahtschneideelektroerodierbearbeitungsvorrichtungen performing simultaneously a plurality of cutting processes using a wire 1a to 1d taken 3 more times between the main guide rollers engaging a Drahtschneideelektroerodierbearbeitungsvorrichtung is provided to suppress the vibration at cutting wire sections CL to allow the cutting process under steady-state accuracy. In addition to the main guide rollers 1a to 1d are vibration dampening, driven guide rollers 7a, 7b or vibration damping guides 21a, included 21b which form a plurality of cutting wire sections CL in which the vibrations are suppressed by the fact that the wire is fed to the intended place 3 and thereby the cutting wire sections CL are clearly defined with respect to the nozzles 8a, 8b.