Light-emitting diode device and manufacturing method thereof

The invention discloses a light-emitting diode device (LED) device, which comprises at least one LED chip and a circuit board. The LED chip has an N pole and a P pole, and an electrode layer is covered on the surface of the N pole and the surface of the P pole, wherein the thicknesses of the electrode layers on the surfaces of the N pole and the P pole are the same. An insulating layer is coveredon the upper surface of the circuit board; a conducting layer is covered on the upper surface of the insulating layer; the upper surface of the area corresponding to the N pole of the LED chip of theconducting layer is provided with a metal layer; and the thickness of the metal layer is equal to the height difference between the N pole and the P pole of the LED chip. The LED chip is inversely arranged on the circuit board, wherein the P pole of the LED chip is connected with the conducting layer through the electrode layer, and the N pole of the LED chip is connected with the conducting layer through the electrode layer and the metal layer. Compared with the prior art, the upper surface of the area corresponding to the N pole of the LED chip on the circuit board in the luminescent deviceis provided with the metal layer, so that the design and the manufacturing process of the LED chip are simplified, and the performance of the LED chip is further improved.