Semiconducting bodies based on Cu-slag

Cu-slag fritted with 50% clay to avoid black spots appearance was used to prepare semiconducting bodies. To improve electrical conductivity the addition of Fe 2 O 3 and TiO 2 content up to 8.65 and 1.72% respectively was studied. The results showed that there is an optimum iron or titanium oxides total content of 7.65% and 1.22% respectively, where electrical and mechanical properties are enhanced. Further increase of Fe 2 O 3 or TiO 2 additions affected positively the bodies physical properties while decreased their electrical conductivity.