Constructing Flexible and CuS-coated Meta‐aramid/Polyacrylonitrile Composite Films with Excellent Coating Adhesion

To achieve electrically conductivity comparable to metallic materials, electroless deposition has attracted much interest for low-cost fabrication of conductive organic materials in recent years. However, the metallized coatings constructed by such kind of method usually have to utilize expensive sensitizer and activator, hindered its use in practical applications. Here, a novel method, no need of sensitizer and activator, was developed for fabricating flexible and conductive m‐Aramid/Polyacrylonitrile (PMIA/PAN) composite film with excellent coating adhesion. We used the PMIA as the matrix and introduced PAN components to prepare a series of PMIA/PAN composite films. A strongly bonded conductive CuS coating is obtained by a redox chemical reaction. It was found that PMIA/PAN=10/1 is the best blending ratio for preparing PMIA/PAN-CuS composite film. And excellent adhesion is exhibited between CuS coating and pure PMIA/PAN organic substrate even after more than 15 times of tape stripping treatment or 170 m...