Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP

W-band (75 GHz - 110 GHz) wireless in-plane chip-to-chip (C2C) communications in 3D System-in-Packaging (SiP) are demonstrated using an integrated compact planar inverted-F antenna (PIFA) with a shorting via wall. As a test vehicle, a 77 GHz compact PIFA with a shorting via has been designed in a PCB substrate and their RF parameters such as reflection coefficients (S11s), antenna gains, radiation patterns have been studied. Milling machine and micro-fabrication has been utilized to implement the proposed 77 GHz PIFA with a shorting via and their RF characterization has been performed. The measured S11 results agree well with the simulated ones. The simulated efficiency and antenna peak gain is 96 % and 1.77 dBi, respectively. An antenna footprint of 0.19 mm2 excluding the feeding line is demonstrated, showing more than 50 % area reduction compared with a disc-loaded monopole antenna.