Whitening phenomena between polyphthalamide sidewall and silicone encapsulant in the light-emitting diode package

White light-emitting diode (LED) packages are generally comprised of pre-mold leadframe, chip, wire, phosphor and encapsulant. During the high junction temperature operation, the whitening phenomena sometimes happen between leadframe sidewall and encapsulant resin. The nontrivial decrease of luminous flux results from the whitening originated from the decomposition mixture between polyphthalamide (PPA) sidewall and silicone resin.