Analysis and characterization of package resonance: Research Articles

This article presents FDTD analysis and prediction of the overall effects of the resonance in ceramic and plastic packages. Practical structures that result in strong resonance effects are investigated, such as coupled cross lines with a via transition and multiple via transitions on a single line. A detailed study of the mutual coupling, including resonance effects, is also performed and presented. The results of the analysis indicate that the package performance can be very sensitive to the resonance effects. A broadband equivalent-circuit model for multiple transition discontinuities (two via holes) on a single line has been developed and presented. Good agreement between the frequency response of the FDTD and the circuit models has been achieved over a broad band of frequencies. The analysis presented in this article provides insight about the limits at which coupling effects on the overall package performance can be neglected. The equivalent-circuit model presented in this article can greatly simplify the analysis and simulation of a complex package, including several transition discontinuities, assuming that the coupling is small. © 2004 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2005.