Insulating resin composition for printed circuit board and products having the same

The present invention provides a printed circuit board and an insulating resin composition for a prepreg, a copper-clad laminate and printed circuit board using the same. More particularly, the present invention has the effect that by a curing agent containing a bipyridine structure, the insulating resin composition, a glass transition improve the heat resistance characteristics of the temperature and thermal expansion coefficient and enhance the mechanical properties of the peel strength between the metal layer and the insulating layer .