Semiconductor device and process for producing
2002
The invention relates to a semiconductor device, which on a rough curved surface (31), in particular a vehicle component (3) is formed, wherein the semiconductor component (1) is deposited or grown directly on the surface. The invention further relates to a method for manufacturing a semiconductor device, the semiconductor device directly on a rough curved surface (31), in particular a vehicle component (3) is deposited, at least one layer (4, 5, 6, 7, 8, 9, 10, 11, 12) of the layered-type semiconductor component (1) is at least partially formed of nanoparticles, which are applied to the curved surface to form the layer.
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