Mems an indirect bonding structure adaptive substrate

The present invention discloses a MEMS structure having adaptive bonded-substrate. It discloses a method of binding a plurality of MEMS structure comprising a substrate and forming the MEMS structure. Exemplary MEMS structure comprises a first substrate and a second substrate having a bottom surface substantially parallel to the first substrate having a top surface of the bottom surface. The bottom surface of the top surface of the first substrate by an anchor member connected to the second substrate, so that the top surface of the anchor member does not extend through the bottom surface of the first substrate or the second substrate. The MEMS structure may include a first substrate in contact with a bottom surface and is shaped to at least partially surround the bonding layer anchor.