2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and preparation method thereof

The invention relates to 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and a preparation method thereof. The adhesive consists of a component A and a component B in a mass ratio of 1:1-2, wherein the component A is a co-polymer formed by the reaction between 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane and epoxy resin; and the component B is a homogeneous transparent solution which has the solid content being 15-30 percent and formed by the reaction between 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane and binary acid anhydride in strong polar aprotic organic solvent and toluene. The preparation method comprises the following steps of stirring and uniformly mixing the component A and the component B at room temperature in a mass ratio of 1:1-2. The preparation process is simple, and the adhesive is excellent in comprehensive performance, so that the adhesive can be widely applied to adhesion among steel, copper, aluminum and other metals, as well as ceramic, glass, resin-based composite materials and other base materials, and has an excellent industrial prospect.