Apparatus and method for backside passivation

Apparatus and method for backside passivation of the substrate is presented. The system, when the substrate is on the support ring, so the gap is formed in a long supporting body, comprising an elongated support having an open upper surface forming a support ring. The plasma generating device for depositing a passivation film on the back surface of the substrate, is coupled to the air gap to produce a plasma in the void. .FIELD 1