High‐temperature thin‐film barriers for foldable AMOLED displays

We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of <2 mm. We demonstrate organic light-emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high-temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active-matrix organic light-emitting diode displays on GEN1-sized substrates. © Copyright 2018 Society for Information Display