Correcting image placement errors using registration control (RegC) technology
2011
The 2009 ITRS update specifies wafer overlay control as one of the major tasks for the sub 40 nm
nodes. Wafer overlay is strongly dependent on mask image placement error (registration errors or
Reg errors) 1 in addition to CD control and defect control. The specs for registration or mask
placement accuracy are twice as difficult in some of the double patterning techniques (DPT). This
puts a heavy challenge on mask manufacturers (mask shops) to comply with advanced node
registration specifications.
Registration test masks as well as production masks were measured on a standard registration tool
and the registration error was calculated and plotted. A specially developed algorithm was used to
compute a correction lateral strain field that would minimize the registration error. A laser based
prototype RegC TM tool was used to generate a strain field which corrected for the pre measured
registration errors. Finally the post registration error map was measured. The resulting residual
registration error field with and without scale and orthogonal errors removed was calculated.
In this paper we present first results of registration control experiments using the prototype
RegC TM tool.
Keywords:
- Correction
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