Housing for high-performance light-emitting diodes - "2-Layer-System"

The present invention relates to a housing for optoelectronic components such as LEDs, and a method of manufacturing the said housing. The housing is a housing for receiving a functional element, in particular a LED, so that the base body forms a base body having a top surface which at least partially defines a mounting area for at least one opto-electronic functional element, a heat sink for at least one opto-electronic functional element, a bottom and a jacket; and at least one connecting member for at least one opto-electronic functional element, which is connected at least by means of a glass layer to the base body, wherein the one connecting body is disposed at least on the shell side to the base body and at least partially extending over the periphery of the base body and wherein at least the top of the the base body at least a first recess having a bottom, which at least provides the mounting region for an opto-electronic functional element has.