Three-dimensional system-in-package structure for metal circuit plate first caged and later etched normal chips and methods of their processing

The present invention relates to a three-dimensional on-chip metal circuit plate structure for first caged and later etched normal chips and a processing method for the production thereof, said structure comprising: a metal substrate frame (1); a feed line (3) in the metal substrate frame (1) is provided; provided one on an upper surface of the supply line (3) conductive column (4); is attached to a chip (5), the normal to an upper surface of the metal substrate frame (1) or between the feed lines (3); a metal wire (6) is connected through an upper surface of the chip (5) with an upper surface of the supply line (3); is a molding material (8), with a peripheral region of the supply line (3), the conductive pillar (4) of the chip (5) and the metal wire (6) is encapsulated, wherein the molding material (8) with a top surface of the conductive pillar ( 4) is flush.