Composite Ag-Ni metal mesh based transparent conductive film for electromagnetic interference shielding application

With the development of wireless microwave electronic devices, electromagnetic interference (EMI) is a new kind of pollution that is becoming increasingly prevalent and has affected the performance of the electronic devices and the human health. Thus,the transparent EMI shielding film is a key component for many practical applications. Conventional methods for the fabrication of transparent EMI film are time-consuming and costly for their employing expensive vacuum-based process. By combination of the scrape and selective electroplating techniques, a vacuum sputtering/evaporation-free processing is explored for the fabrication of high-performance metal mesh based TCF. The fabricated composite Ag-Ni mesh TCF exhibits ultra-low sheet electrical resistance (Rs=0.07Ω sq−1) at average transmittance of 70% in the visible region. The measured shielding efficiency can be greater than 30dB in X-band. Both experimental and theoretical results are given in the paper. By using the proposed method, TCF based EMI film can be easily fabricated for mass-manufacturing.