Low temp. solidifeed resin emulion used for cathode electrolytic coating

The present invention relates to a low-temp. soldified resin emulsion for cathodic electrophoretic coating. It is made of 20-70% of modified epoxy resin, 5-50% of polyamine and 10-30% of closed polyisocyanate which can completely declosed at 120-140 deg.C, through the processes of chemical reaction, mixing, neutralizing with organic acid and dispersing in water, in which the modified epoxy resin is made up by using epoxy compound and polyhydroxylated compound and adopting epoxy resin synthesis method under the action of catalyst, its molecular weight is 300-3000, and the pure solid weight ratio of epoxy compound and polyhydroxylated compound is 5-8/2-5. The described epoxy compound is bisphenol A diglycidyl ether and glicidyl ether containing flexible chain or glycidyl ester, and the polyhydroxylated compound is bisphenol A and polyhydroxylated compound containing flexible chain.