3D Integration of Sensors and Electronics

A three dimensional integrated circuit is composed of multiple tiers of integrated electronics and sensors integrated vertically by wafer bonding, thinning and insertion of through-silicon-vias. The technologies associated with three dimensional integrated circuits can provide new capabilities for high energy physics and x-ray imaging experiments. These include finer pixel pitch, lower interconnect capacitance, the ability to separate analog and digital functions, and better power distribution and connectivity. In this paper we review the status of 3DIC demonstration projects at Fermilab, discuss several possible applications, and summarize the current availability of commercial processes. Results of a three-tier demonstration project that includes designs for x-ray imaging, CMS track triggering, and ILC vertex are described. We discuss the status of several ongoing 3D projects and prospects for future evolution of the technology.