Aluminum-based copper-plated graphene film composite material with high heat-conducting property and preparation method thereof

The invention discloses an aluminum-based copper-plated graphene film composite material with high heat-conducting property and a preparation method thereof. The preparation method comprises the following steps of: de-oiling an aluminum substrate sample for 3min in a 65 DEG C de-oiling solution and then cleaning by clear water; carrying out bright dipping on the de-oiled sample for 2min in a 25 DEG C bright dipping solution and then cleaning by clear water; carrying out zinc dipping on the sample (subjected to the bright dipping) for 2min in a 25 DEG C primary zinc dipping solution and then cleaning by clear water; carrying out zinc dipping on the sample (subjected to the primary zinc dipping) for 2min in a 25 DEG C secondary zinc dipping solution and then cleaning by clear water; plating the sample (subjected to the secondary zinc dipping) for 5min by direct current in a 25 DEG C priming copper plating solution, wherein the current density is 1-4A/dm2, the polar distance is 5cm, and then cleaning by clear water; plating the sample (subjected to the copper plating) for 20-40min by directional pulse in a 25 DEG C composite copper plating graphene plating solution and then cleaning by clear water, wherein the current density is 1-4A/dm2 and the polar distance is 5cm. The preparation method has the following advantages that the requirement on equipment is low, the operation is convenient, the process route is clear and the thickness of the film is controllable.