Method and system for processing semiconductor wafer

PURPOSE: To obtain a processing method and a system for processing a wafer variously, including mechanochemical processing, wet chemical processing and oxidation, using a single unit. CONSTITUTION: A fixed base 104 containing an anodic oxidation fluid is set in the center of a rotatable polishing pad 102. A wafer is held by a rotatable work holder 8 fixed to a turntable stretching arm 5. The wafer is transferred to either one of the polishing pad 102 or the anodic oxidation fluid and subjected to polishing or anodic oxidation. COPYRIGHT: (C)1996,JPO