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Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution
Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution
2017
Zhihua Tao
Wei He
Jing Li
Shouxu Wang
Yuanming Chen
Kehua Ai
Yongqiang Peng
Yan Hong
Keywords:
Chemistry
Microvia
Inorganic chemistry
Copper plating
Correction
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