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Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging.
Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging.
2021
Florian Merget
M. Ackermann
Bin Shen
G D Saunders
S Haag
M. Wolz
Jeremy Witzens
Keywords:
Materials science
Optoelectronics
Wafer
Component (UML)
Interposer
scale
Correction
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