Old Web
English
Sign In
Acemap
>
Paper
>
Non-destructive evaluation of CSP reliability using scanning acoustic microscopy
Non-destructive evaluation of CSP reliability using scanning acoustic microscopy
2000
Jim Stradling
Keywords:
Chip-scale package
Optoelectronics
Electronic packaging
Acoustic microscopy
Nondestructive testing
Electronic engineering
Engineering
Scanning Acoustic Microscopy
non destructive
Correction
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]