Study of a multifin thermal conductor for cooling heat-dissipating components. II

To predict the thermal contact resistance between a heat-dissipating component and a multifin thermal conductor, an existing theory for ideal surfaces in low pressure contact is discussed. The experimental data obtained using actual machined surfaces in a helium or nitrogen gas environment under contact pressures below 0.01 MPa are correlated by the theory to an accuracy from + 12 to − 25 percent. The effect of helium gas concentration on the thermal contact resistance is also analyzed, taking into account variation in the accommodation coefficient