The photosensitive resin composition, a method of manufacturing a photosensitive element, resist pattern, and a method for manufacturing a printed wiring board

(A) a binder polymer, a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a photosensitive resin composition containing a polymerization inhibitor having an ethylenically unsaturated bond in the (B) molecule , (C) includes the photopolymerization initiator acridine compound, (D) the content of polymerization inhibitor is 20 to 100 mass ppm, the photosensitive resin composition.