Semiconductor device having a fine pitch type bondpad

A semiconductor device having a micro pitch type bond pad is provided to perform a micro pitch type bond pad by forming a plurality of dummy bond pads in a space between bond pads. A semiconductor chip device(200) includes a semiconductor chip, bond pads(102), and dummy bond pads(104). The bond pads are formed on the semiconductor chip. The bond pad has a width narrower than a diameter of a ball bond. The bond pads are electrically connected to a circuit part of the semiconductor chip. The dummy bond pads are positioned on the semiconductor chip, and are formed between the bond pads. The dummy bond pads are not connected to the circuit part of the semiconductor chip.